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38 shows a schematic viscosity curve for a typical cure cycle In a high-flow B stage, the initial cure level is low This results in a longer time at temperature before the B-stage viscosity rises due to cure This is often described as a long gel time In terms of Fig 2738, a high-flow B stage has a low minimum viscosity and a wide region of maximum flow A low-flow B stage has a higher degree of initial cure and may include flow restrictors to increase the minimum viscosity High-flow B stages are useful.

in presses with a high-heating rate where the resin may begin to cure before flow is complete. They give excessive flow if used in a press cycle with a very slow heating rate.

Single-Ply versus Multiple-Ply B-Stage Fill Considerations For dielectric separations that could be filled by either one thick ply of B stage for instance, style 7628 or by two thinner plies of B stage for instance, style 1080 the fabricator and engineer need to determine which approach is best on a product-by-product basis. Building ML-PCBs with single-ply B-stage fill is common and has the following advantages:

40 0 500 3125 016

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Costs are reduced significantly when sheets of prepreg are eliminated the main advantage. Z-axis expansion is easier to control since there is usually less resin with a thicker style. Overall thickness has less variation since there are fewer elements in the construction. Single-ply fill allows for overall thickness reduction when two plies of any style are replaced by one ply of the same style or thinner.

The UART Data I/O registers are actually two separate registers, sharing the same physical address. When data is written to this address, it gets written to the data transmit register, and when reading from this address it is read from the data receive register. (Figure 3.26.)

Building with two plies is usually either preferred or required with the following conditions:

The separation to be filled is between two planes generating a large voltage bias and additional dielectric separation is required to minimize the potential of dielectric withstanding breakdown. The separation to be filled is between two layers having thicker (70 micron) copper foil. In this case, there is frequently insufficient resin in a single ply to encapsulate the features and prevent air bubbles in etched-out regions.

A good lamination cycle produces a flat ML-PWB that is free of moisture or voids and has a fully cured substrate. All layers must be well registered. The ML-PWB must be free of warp and the thickness must be within the specification. Any controlled impedance layers must have the correct pressed dielectric separations above and below the signal layer. Each of these requirements puts special demands on the lamination process.To assist in setting control measures, the following process indicators (see Table 27.6) should be monitored with a Statistical Process Control (SPC) method.

125 500 0 025

TABLE 27.6 Process Variables and Limits Process indicator Thickness control Heat rise /min. through melt Cure Post cure Registration Dielectric separation Specification limit Per engineering drawing or internal spec requirement Per resin system requirement Tg of resin system Dwell time/temp per resin system requirement Per engineering drawing or internal spec requirement Per engineering drawing Gauge type or method Over-arm micrometer Chart recorder TMA Chart recorder Appropriate coupons or x-ray inspection equipment Cross section

Common Problems 27611 Voids and Moisture Substrate voids are a serious problem in many lamination processes One source of these problems is moisture B stage is very hygroscopic and must be stored in a low-humidity environment to preclude serious void problems C-stage components also have a tendency to absorb water, and many fabricators use a bake to dry layers prior to lamination However, for a fast innerlayer line with a good dryer in the oxide line, an innerlayer bake may not be necessary Voids generally cluster in the low-pressure regions near the edge of the panel This effect is minimized by the use of vacuum lamination Increasing the lamination pressure can also reduce voids However, the use of high pressures with high-flow materials can result in excessive flow, which leads to other substrate flaws such as resin starvation 27612 Blisters and Delamination.

Blisters and delamination are also caused by trapped volatiles that collect in the low-pressure regions associated with print-through If a board has wide copper borders on every layer, blisters are often found in the lower-pressure circuit areas adjacent to the borders The best solution to this problem is to avoid areas of heavy copper adjacent to low-density circuit areas by replacing solid borders with a dot or stripe pattern Also, the glass style and resin content of the prepreg should be matched to the weight of copper thickness adjacent to the prepreg 27613 Under Cure The requirement of full cure is relatively easy to obtain if proper cure time and temperature are used One measure of the cure level is Tg Periodic measurements of Tg are an excellent check for material and process consistency.

The UART status register is used to monitor the status of the UART. The significant bits of the USR are:

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