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Another way to check cure is to make two consecutive measurements of Tg: If the epoxy is only partially cured, it will continue to cure during the first measurement and a higher Tg will be detected on the second measurement A shift in Tg of more than 5 C is an indication of under cure This measurement is typically performed on a TMA Figure 2739 shows an example of an epoxy TMA run; note that the second TMA run has a delta of 3 C 27514 Post-Lamination Bake Many fabricators bake the ML-PWB at 150 C for up to four hours after lamination One purpose of this baking is to ensure a complete cure..

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FIGURE 27.39 TMA analysis of epoxy with woven fiberglass. (Courtesy of Microtek Labs, Anaheim, CA.)

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Although a bake will advance the cure, it is unnecessary if a proper lamination cycle is used (although polyimide is an exception; check the recommended processing guidelines). As discussed earlier, this can be verified by Tg measurements. However, additional baking beyond full cure degrades the material and reduces Tg. A second purpose of the bake is to reduce the warpage often seen in the outer boards of a stack-up. Although a post-lamination bake will flatten the boards, it is more of a repair than a root solution. If the panels are cured in the press in a way that ensures they go through Tg in an isothermal stress-free state, warpage should not occur. The warpage seen in the outer boards of a stack is generally a symptom of nonuniform cooling. The third purpose of a bake is to relax internal stress and improve registration. Internal stresses are a symptom of an overdetermined tooling system. If such a system is used, a bake may improve registration. If the more popular four-pin system is used, a bake is unnecessary. Always confirm the need of a post cure with the recommendations of the material supplier.

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2762 Special Consideration for Non-Dicy, Non-Bromine, and LFAC Laminates For decades, the majority of PCBs have been built with epoxy resins, dicy-cured, and with bromine flame retardantThe industry has developed around this paradigm Drills and drilling, chemistry, lamination, and circuit card assembly are all well understood with reference to standard FR-4 Although there are fabricators with processes developed to manufacture PCBs using laminates other than standard FR-4, this knowledgebase is not distributed industrywide Especially problematic is the intersection of requirements for HF and/or LFAC with high thermal resistance and improved electrical characteristics, such as low attenuation in the material Many laminators recognized that the heart of their product line would need to be revamped from the entry-level cost-conscious material all the way through to the highest performance material.

This was a large undertaking, requiring many different trials to find the right ingredients, in the right combinations, with the desired properties, especially the response to the new elevated reflow temperatures As is frequently the case, there are trade-offs For instance, reducing CTE by increasing filler is desirable to a point; the increase of filler increases the dielectric constant and loss tangent properties of the material, making it less suitable for high-speed digital products The line-up from the bottom to the top of the performance ladder, with and without bromine, capable of withstanding high-temperature reflow, isn t complete in all cases These materials have not been in manufacturing and the field as long as the time-honed standard epoxy systems Also, as they have been used, they have also been continuously refined which has caused processes to be continuously redefined.

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The major processes that need to be developed and optimized specifically for nonstandard FR-4 laminates are innerlayer adhesion promotion, lamination, drilling, and hole wall preparation The fabricator must work closely with its laminate and chemistry providers to develop the specific process parameters that will work with their lamination equipment and chemistries The major problems have been delamination (both adhesive and cohesive failures), voiding, and hole wall pull-away Some of these quality problems can be discovered prior to shipment by cross-section analyses, but some do not manifest until after high-temperature reflow Since laminators test laminates rather than finished PCBs, and fabrication and design features both effect the final product, a cautious fabricator will test completed PCB parts for quality and reliability, simulating the intended assembly soldering profile Accordingly, submitting an actual final ML-PWB to multiple cycles through a production reflow oven with a lead-free soldering profile can be advantageous.

After reflow exposure, the parts are visually inspected for blisters, then cross sections are taken at both high and low hole density areas to look for internal delamination or laminate cracks, voiding, and hole wall pull-away Figures 2740 through 2743 show examples of these defects..

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